After debuting the 1.6T OSFP224 module at ECOC 2024, Accelink continue speeding up technology innovation. At OFC 2025, Accelink will demo an upgraded 1.6T OSFP224 with a 3nm DSP, extending the lifespan of high-speed pluggable optical transceiver in AI interconnection application. Accelink sincerely invites global customers to witness the new 1.6T OSFP224 DR8 module.

This new generation of 1.6T OSFP224 DR8 optical transceiver is perceived as three major technological breakthroughs:

·Compared with the previous 5nm solution, the 3nm DSP chip paired with silicon photonics technology significantly reduce the module's power consumption, effectively overcoming the heat-dissipation bottleneck in high density AI cluster deployments.

· Based on its original signal integrity architecture, it has broken through in stably transmitting 8×200G signals over 500 meter single-mode optical fibers, reliably supporting the 200G SerDes system.

· The module design could achieve a switching capacity of 100T within 2U rack mount size, providing a scalable deployment solution for Hyperscale Data Centers.

During the OFC exhibition, Accelink will also showcase the full-scenario 800G product series covering DSP, LPO, LRO and other technology route, along with a fully immersed liquid-cooled optical transceiver solution. The product portfolio meets the diverse needs of AI clusters, intelligent computing centers, and cloud data centers applications.