On September 10th, the 26th China International Optoelectronic Exposition‌ (CIOE 2025) grandly opened at the Shenzhen World Exhibition and Convention Center. With the theme of "Optics for AI ·Optics for the Future", Accelink made its appearance at Booth B53 in Hall 11, showcasing a number of global first-launch products. This event fully demonstrated Accelink's nearly 50 years of technological accumulation and product capability in the optical communication industry. The booth was bustling with visitors, attracting a large number of attendees to stop by, and fully highlighting Accelink's unique technological charm in the field of AI computing power optical interconnection.

Accelink Shines at CIOE with AI "Core" Technology: Illuminating the Future and Breaking New Ground global first-launch + on-site demonstration：

·1.6T OSFP224 2xDR4 Transceiver: Covering various technical routes such as DSP, LPO, and LRO, this new masterpiece for the next-generation AI cluster interconnection features performance advantages like high bandwidth and low latency.

·800G Series Products: Equipped with Accelink's self-developed optical chips, the full-series products interconnection Live Demo fully demonstrates Accelink's full-stack independent R&D capabilities.

·New-Generation CPO (Co-Packaged Optical) Interconnection Technology Solution: The global first launch CPO technology provides a new high-density, low-power-consumption, and high-reliability optical interconnection solution for high-performance data centers and computing networks.

·C+L Band Series Integrated Optical Components: Promoting the evolution of optical transport networks towards high efficiency and flexibility, this series products meet the evolution needs of explosive growth of network traffic in the intelligent computing era.

·Compact-Size OFDR Module: It is also a global first launch product which combines a compact structure design with independent and controllable features, enabling high-precision sensing functions for temperature and stress, and providing accurate monitoring support for manufacturing, communication, and other scenarios.

·Integrated Sensing and Communication Solution: The hybrid 100G/400G/800G C+L band coherent transmission is on-site demonstrated , integrated with distributed optical fiber status sensing functions.

Core Technology + Professional Services - An Immersive Experience of "Vertical Integration"

Stepping into Accelink's product exhibition area, you will find it clearly visible that the full range of products from optical chips, components to optical modules intuitively present the "vertical integration" technological strength to the audience. From 400G to 800G and further to 1.6T, the on-site demonstration could display cutting-edge technological achievements and application solutions in the optical communication field. The professional on-site explanations could also help the audience quickly understand Accelink's cutting-edge technologies.

The professional on-site explanations also help the audience quickly understand Accelink's cutting-edge technologies. The booth was always crowded with people, and professionals from both inside and outside the industry stopped to communicate, making it a "popular check-in spot" at the CIOE site.

Currently, information technology and artificial intelligence are deeply integrating. At this globally watched optoelectronic event, Accelink not only presents a "solid" technology and product examination sheet but also extends a sincere invitation to the entire industry - looking forward to gathering with every partner and innovator at CIOE to jointly explore new possibilities in optical interconnection!