On September 29, the European Conference on Optical Communication (ECOC 2025), the largest optical communication event in Europe, commenced in Copenhagen, Denmark. Under the theme "Leap into the Future of Photonics", Accelink made a remarkable appearance, engaging in open product demonstrations and in-depth discussions with global partners to explore new industry opportunities.

In the open demonstration area, Accelink conducted live demonstration of its high-speed 1.6T OSFP224 optical transceivers designed for AI computing centers. The module achieved back-to-back zero-bit-error transmission of 200G signals over single-mode fiber, attracting significant attention from customers, experts and scholars. Leveraging advanced 3nm DSP and silicon photonics engine technologies, the product reduces power consumption by 30% and demonstrates exceptional signal integrity, making it a highlight of the event. Also showcased were the 1.6T LRO/LPO series products, which further optimize power consumption and cost through architectural simplification, offering competitive solutions for AI data centers. Additionally, the new-generation 800G OSFP112/OSFP224 optical transceivers were demonstrated live, highlighting the robust performance of 200G/lane silicon photonics technology and garnering considerable customer interest.

The new product exhibition zone featured several innovative solutions: Twin 2×32 WSS based on proprietary LCOS technology; new-generation high-resolution OCM product supporting rates from 10G to 1.6T; pluggable QSFP-packaged OTDR supporting up to 160 km fiber monitoring; and the multi-channel SGA series products enabling flexible expansional repeaterless transmission. Together, these solutions form an efficient, flexible, and intelligent optical layer foundation for next-generation data center interconnection. Furthermore, 2D FAU and 2D/3D Shuffle high-density optical connectors and cables, which are compatible with various intra-data-center connection scenarios, facilitate easy fiber deployment and efficient management, providing customers with high-performance and highly flexible solutions that strongly support the construction of AI data centers.

During the event, Accelink held in-depth exchanges and collaboration discussions with participants from around the world, expressing eagerness to partners or other industry players to explore the future innovation of data center interconnect.

The exhibition will last until October 1. We sincerely invite industry peers from home and abroad to visit our booth C2124 to learn more about Accelink's innovative products and technologies. Accelink will remain committed to keeping eyes on market trends, promoting product innovation, and delivering high-quality products and services to global customers.